H-DEC – FOUP Cleaning System
H-DEC – FOUP Cleaning System
A FOUP (Front Opening Unified Pod or Front Opening Universal Pod) is a highly specialized plastic enclosure developed to securely store silicon wafers in a controlled environment. These pods facilitate the safe transfer of wafers between processing or measurement equipment during semiconductor manufacturing.
The FOUP cleaner by ATG Technologies plays a critical role in improving yield by addressing potential contamination issues. By implementing ATG Technologies’ FOUP solutions,you can achieve superior cleanliness standards and optimize your production yield.
H-DEC - FOUP and FOSB Cleaner
Technical Specifications
Product Features – Batch preparation up to 4 FOUPS:
- HAUD Oven Loading Cell
- Foup Opeening:Door unlock
- Doors and boxes Buffer Shelves:
- Wafer in foup control: Laser detection
- Precise robot movement
- Oven door piloting: automatic opening and closing
- Oven loading FOUP boxes / doors
- FOUP unloaded on 2 OHT load ports or on manual load port
High througput
Fully Connected
Low Footprint
High Ergonomics
ATG Technologies
Entering Industry 4.0
Engineering solutions for the semiconductor fab
H-DEC - FOUP and FOSB Cleaner
Benefits
Key benefits of FOUP cleaning solution By ATG Technologies include:
- Particle Removal: Eliminates particulates that could compromise wafer integrity.
- Humidity Reduction: Mitigates the risk of moisture-related defects.
- AMC Reduction: Decreases airborne molecular contaminants (AMCs).
- Low Cross-Contamination: Minimizes the transfer of contaminants between wafers.
